HYPOX® RA 95 by Huntsman is a high viscosity, bisphenol A epoxy resin modified butadeine-acrylonitrile elastomer. It exhibits higher temperature performance and greater green strength, making it... view more

Hardener XB 3473 by Huntsman is a latent polyamine based hardener. It allows parts manufacture to tailor specific formulation processing characteristics and cured polymer properties. Hardener XB... view more

Matrimid® 2292 by Huntsman is a diallyl ether of bisphenol-A based low viscosity resin. Used as a reactive diluent with epoxy, bismaleimide and polyimides. Exhibits excellent mechanical properties... view more

Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites... view more

4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good... view more

Matrimid® 5292B by Huntsman is an O,O-Diallyl Bisphenol A based reactive diluent with epoxy, bismaleimide, polyimides. It exhibits outstanding heat performance and excellent mechanical properties at... view more

Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or... view more

Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more

Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more

Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting... view more

Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and... view more

Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the... view more

Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The... view more

Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more

Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more

Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more

Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more

Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more

Resin XB 4399-3 is a tetra hydroxyphenyl ethane based solid polyfunctional epoxy resin. Exhibits high glass transition temperature, UV-blocking, better dimensional stability, higher cross-link... view more

Resin XU 3508 by Huntsman is a liquid toughened, bisphenol A based epoxy resin. Provides high toughness without decrease of glass transition temperature. It can replace partly or totally standard... view more