Melapur™ MC25 by BASF is an effective flame retardant. It offers good mechanical properties and lower specific gravity compared to compounds containing halogen & antimony flame retardant systems... view more

PES-1069 is a solventborne high molecular weight & saturated copolyester by Heyo Enterprises. PES-1069 is recommended for PCB adhesives... view more

Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more

Omnivadd SP 5005 by IGM Resins is a wetting and dispersing additive for solvent-borne systems. It provides better wetting and impact resistance while reducing the viscosity. It has an aromatic... view more

Omnivadd SP 5010 by IGM Resins is a wetting and dispersing additive for solvent-borne systems. It improves wetting and prevents flooding & floating. It reduces viscosity & haze, and enhances gloss &... view more