Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

ATUREX® 450 by Aturex is a non-corrosive, standard medium-viscosity polyamide amine. Acts as a curing agent for epoxy resin based formulations. Provides cure at low temperatures under damp... view more

Cardolite® NC-556S80 by Cardolite is phenalkamine. Used as curing agent for epoxy adhesives. Provides high solid formulations, rapid cures with a workable pot life, good acceptance to poorly... view more

Cardolite® NX-4901 by Cardolite is phenalkamine. Used as curing agent for epoxy adhesives. Suitable for high solid and solvent-free formulations. Offers rapid cure with a workable pot life, good... view more

Cardolite® NX-4903 by Cardolite is 100% solids, low viscosity and solvent-free phenalkamine. Used as curing agent in epoxy adhesives. Possesses very good penetration and adhesion to damp, wet or dry... view more

Cardolite® NX-4913 by Cardolite is 100% solids, low viscosity and solvent-free phenalkamine. Used as curing agent in epoxy adhesives and sealers for concrete. Possesses very good penetration and... view more

Molcure C321 by Changzhou Moltec Materials is an efficient cationic photoinitiator. It is used in UV polymerization and curing of corresponding resins, especially aromatic, aliphatic & alicyclic epoxides. It is... view more

Molcure C413 by Changzhou Moltec Materials is a high quality, efficient cationic photoinitiator. It is recommended for UV polymerization and curing of corresponding resins, especially aromatic, aliphatic & alicyclic... view more

An organic phosphinate based white, fine-grained powder. Acts as a flame retardant. The product is non-hygroscopic and it is insoluble in water and common organic solvents like acetone... view more

Exolit® OP 945 by Clariant is a halogen-free flame retardant based on an organic metal phosphinate. It is a non-hygroscopic, fine-grained powder with high phosphorus content and low smoke toxicity. It... view more

Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more

ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low... view more

ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other... view more