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Product Name
Supplier
Description
Resicure™ 2-MI
A&C Catalysts
Resicure™ 2-MI by A&C Catalysts is 2-methyl imidazole. It acts as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin-based formulations. It offers high chemical...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding
Transportation (excl. Automotive)>Aircraft & Aerospace
Technicure® LC-100
A&C Catalysts
Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding
Technicure® Nano-Dicy
A&C Catalysts
Technicure® Nano-Dicy by A&C Catalysts is a pulverized grade of dicyandiamide, acts as a curing agent with an average particle size of about 1-2 micron. Provides excellent adhesion to a variety of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding
Transportation (excl. Automotive)>Aircraft & Aerospace
Exolit® OP 930
Clariant
An organic phosphinate based white, fine-grained powder. Acts as a flame retardant. The product is non-hygroscopic and it is insoluble in water and common organic solvents like acetone...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Exolit® OP 945
Clariant
Exolit® OP 945 by Clariant is a halogen-free flame retardant based on an organic metal phosphinate. It is a non-hygroscopic, fine-grained powder with high phosphorus content and low smoke toxicity. It...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Aradur® 3123
Huntsman
Aradur® 3123 by Huntsman is an imidazole based accelerator/latent curing agent. Exhibits very low solubility in epoxy resins and solvents at RT. Recommended as latent catalytic curing agent for...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Rail
Electrical & Electronic Bonding>Poting & Encapsulating
...
Aradur® 9664-1
Huntsman
Aradur® 9664-1 by Huntsman is a curing agent used with Araldite® epoxy resins. It is 4,4' diaminodiphenylsulfone grade. Exhibits excellent thermal stability and high temperature properties with...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Marine
Industrial Assembly>Sporting Goods
...
Aradur® 976-1
Huntsman
Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive>Interior vehicle (OEM)
...
Omicure® DDA 10
Huntsman
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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