3M™ Boron Nitride Cooling Filler Agglomerates CFA 100 by 3M is randomly oriented agglomerates for high filler loadings and isotropic thermal conductivity. Its softness helps facilitate low impact on... view more

3M™ Boron Nitride Cooling Filler Agglomerates CFA 150 by 3M is soft agglomerates for high filler loadings and isotropic thermal conductivity. It helps facilitate low impact on viscosity and easy... view more

3M™ Boron Nitride Cooling Filler Agglomerates CFA 250SS by 3M is boron nitride platelets spray-dried with inorganic binder to spherical granulates for high flowability and dosing velocities during... view more

3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M by 3M is a mixture of agglomerates, platelets and boron nitride clusters. It provides excellent heat transfer capabilities (through-plane), high... view more

3M™ Boron Nitride Cooling Filler Flakes CFF 200-15 by 3M is powder of textured agglomerates preferred for lowest viscosity in epoxies and silicones. It is ideal as a secondary filler for the... view more

Resicure™ 2-MI by A&C Catalysts is 2-methyl imidazole. It acts as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin-based formulations. It offers high chemical... view more

Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride... view more

Technicure® Nano-Dicy by A&C Catalysts is a pulverized grade of dicyandiamide, acts as a curing agent with an average particle size of about 1-2 micron. Provides excellent adhesion to a variety of... view more

Silica. Acts as a filler. It is a unique nano silica powder. It gets dispersed in organic solvent easily. Possesses small particle size. It shows high dispersability, has high purity and high... view more