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Adhesives Ingredients
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Product Name
Supplier
Description
EPALLOY® 7138
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Joint cement / Grouting
...
EPALLOY® 7170
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low...
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Applications
Adhesives
Sealants
Buildings & constructions>Concrete
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 7192
Huntsman
EPALLOY® 7192 by Huntsman is an unmodified, high molecular weight Bisphenol-A based epoxy resin that is a semi-solid material at room temperature. It provides faster cure, improved adhesion, more...
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Applications
Adhesives
Industrial Assembly
EPALLOY® 7200
Huntsman
EPALLOY® 7200 by Huntsman is a chemically modified liquid diglycidyl ether of Bisphenol-A epoxy resin. It is completely free of acrylates, designed for fast cure and low temperature applications. It...
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Applications
Adhesives
Industrial Assembly
Buildings & constructions
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