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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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10 products match your search
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Cardolite® NX-2026 is a high purity cardanol, bio-based diluent, resin modifier, and accelerator designed for use in adhesives and sealants. It is based on natural, renewable, non-food raw material... view more
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Cardolite® LITE 3040 is a solvent free, low viscosity phenalkamide epoxy curing agent by Cardolite. Exhibits excellent mechanical properties and excellent adhesion. Provides outstanding durability... view more
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Cardolite® NT-1542 by Cardolite is a solvent-free, medium viscosity reactive polyamide epoxy curing agent. It exhibits high Tg, excellent mechanical properties i.e., toughness, hardness, and... view more
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Cardolite® NT-1544 by Cardolite is a solvent-free, medium to low viscosity reactive polyamide epoxy curing agent. It exhibits high Tg and excellent mechanical properties, i.e., toughness, hardness... view more
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Dynasylan® 1124 by Evonik acts as an adhesion promoter and surface modifier with excellent crosslinking properties. It is a secondary aminofunctional methoxy-silane possessing two symmetric silicon... view more
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Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity... view more
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Covestro
Desmocap® 12A by Covestro is a linear aromatic urethane polymer with ether groups. Acts as plasticizer used in combinations of epoxy resins with it may cause turbidity in the cured products. This... view more
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