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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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96 products match your search
Product Name
Supplier
Description
TRINSEO™ DL 280NA by Trinseo is a non-yellowing, styrene acrylate latex. Offers heat sealability, light stability, cohesive- and adhesive strength. Shows resistance to efflorescence and stain... view more
ENCOR® 4374 by Arkema is vinyl maleate with polyvinyl alcohol as stabilizing system. It is recommended for packaging and paper converting like general converting, envelopes and heat sealable. ENCOR®... view more
Luphen® D 200 A by BASF is an aqueous dispersion of a polyester-polyurethane elastomer. Luphen® D 200 A is used in adhesives for laminating, flocking and heat-sealing... view more
Luphen® D 207 E by BASF is an aqueous dispersion of a polyester-polyurethane elastomer. It improves the heat resistance of the bond and its resistance to hydrolysis. Luphen® D 207 E is used in... view more
Luphen® D DS 3528 by BASF is an aqueous dispersion of a polyester-polyurethane elastomer. Used in adhesives for laminating and heat-sealing... view more
Celanese
Mowilith® DC by Celanese is vinyl acetate homopolymer dispersion available as white liquid. It can be modified by water-soluble salts, metal powder or metal bronze. Mowilith® DC is used in paper &... view more
Bynel™ 41E719 by Dow is anhydride modified linear low-density polyethylene (LLDPE) resin. Used in adhesives for packaging industry. Offers improved thermal resistance over that of ethylene vinyl... view more
Copolymer of ethylene and butyl acrylate containing 7% butyl acrylate. Used in adhesives. Possesses good sealing properties... view more
Ethylene-vinyl acetate copolymer resin. Used in low temperature heat seal and flexible packaging applications... view more
Ethylene-vinyl acetate copolymer resin. Used in low temperature heat seal and flexible packaging applications... view more
Ethylene-vinyl acetate copolymer resin. Used in low temperature heat seal and flexible packaging applications... view more
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