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Adhesives Ingredients
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Adhesives Ingredients
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Description
Ancamide® 260A
Evonik
Ancamide® 260A by Evonik is a reactive polyamide with low viscosity. It is used in adhesives, sealants and putties. It acts as a curing agent. It possesses good chemical-, water- and corrosion...
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Applications
Adhesives
Sealants>Putty
Polymers>Epoxies (EP)
Esacure KL 200 Discontinued
IGM Resins
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV...
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Applications
Adhesives>Radiation Curing (UV/EB) adhesives
Sealants>Putty
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