Low viscous modified aliphatic polyamine. Used as a very reactive epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives and putties... view more

Modified heterocyclic polyamine. Used as an epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives and putties... view more

Modified heterocyclic polyamine. Used as an epoxy hardener for the formulation of solvent-free epoxy systems in applications such as fast-curing adhesives and putties. Provides low cure temperatures... view more

High reactivity, phenol-free Mannich-base. Used as a fast curing epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives and putties. Provides good... view more

Ancamide® 260A by Evonik is a reactive polyamide with low viscosity. It is used in adhesives, sealants and putties. It acts as a curing agent. It possesses good chemical-, water- and corrosion... view more

Versamid® 229 by Huntsman is used as a curing agent for fluid epoxy resins. It is used in adhesives and putties applying under critical atmospheric conditions, on wet surfaces, and even underwater... view more