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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Cardolite® NX-5454 is phenalkamine epoxy curing agent by Cardolite that has faster cure at low temperature, i.e. 0°C. Utilized as a solvent-free hardener for epoxy adhesives and as a co-curing agent... view more
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-9001 by Cardolite is polyether polyol based on cashew nutshell liquid technology. It offers excellent water resistance resulting in reduced moisture sensitivity and good hydrolytic... view more
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Cardolite® NX-9001LV by Cardolite is a low viscosity polyether polyol grade based on cashew nutshell liquid technology. It offers excellent water resistance (resulting in reduced moisture... view more
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Dynasylan® SIVO 203 by Evonik is a multifunctional aminosilane compound. Acts as an adhesion promoter. Provides improved product performance and quality. It is soluble in alcohols, aliphatic and... view more
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Dynasylan® 1122 by Evonik is bis(3-triethoxysilylpropyl)amine-based adhesion promoter and surface modifier. This secondary aminosilane provides good flexural strength, tensile strength, impact... view more
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