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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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121 products match your search
Product Name
Supplier
Description
DISPERCOLL® U 8755 by Covestro is an anionic high-molecular-weight polyurethane dispersion. Has outstanding bonding properties on most synthetic and natural materials. Possesses thermal stability and... view more
Aqueous polyurethane dispersion. Used for the formulation of heat-activated adhesives for use in footwear, 3-D film lamination like furniture and car door interior trim... view more
Aqueous polyurethane dispersion. Used for the formulation of heat-activated adhesives for use in, for example, the furniture, automotive, footwear and construction industries... view more
Aqueous polyurethane dispersion. Used for the formulation of latent-reactive polyurethane dispersion adhesives for the fabrication of furniture fronts(3D or membrane process)... view more
It is an aqueous anionic polyurethane dispersion. It provides excellent adhesion to plasticized PVC and other plastics, good heat resistance and compatibility with many compounding ingredients... view more
DIC Corporation
HYDRAN™ GP-100 by DIC Corporation is an aliphatic, environment-friendly, waterborne polyurethane resin. It exhibits wet lamination, aging-free and no cross linker film properties. It helps to reduce... view more
DIC Corporation
HYDRAN™ GP-500 by DIC Corporation is an aromatic, environment-friendly, waterborne polyurethane resin. It possesses dry lamination, long pot-life and no cross linker film properties. It helps to reduce... view more
NeoPac™ E-850 by DSM is an aliphatic urethane acrylic copolymer system. It is a formaldehyde-free resin. Offers bond strength, heat resistance, water resistance, activation temperature and broad... view more
DYNACOLL® AC 1520 by Evonik is a blend of methyl methacrylate and n-butyl methacrylate available in the form of beads. It is recommended for the formulation of reactive hot-melt adhesives. It offers... view more
DYNACOLL® AC 1620 by Evonik is a blend of methyl methacrylate and n-butyl methacrylate. It is recommended for the formulation of reactive hot-melt adhesives. It is suitable for FRP panels, foam or... view more
DYNACOLL® AC 1630 by Evonik is a bead polymer based on methyl methacrylate and n-butyl methacrylate blend. It offers low viscosity, very long open time, aggressive tack and high creep resistance. It... view more
DYNACOLL® AC 1631 by Evonik is a blend of methyl methacrylate and n-butyl methacrylate available in the form of beads. It imparts low viscosity, very long open time, good tack and high creep... view more
DYNACOLL® AC 1632 by Evonik is a bead polymer based on methyl methacrylate and n-butyl methacrylate blend. It provides outstanding quality and flow properties. It imparts low viscosity, very long... view more
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