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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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8 products match your search
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DYNACOLL® 7210 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
DYNACOLL® 7220 by Evonik is saturated polyester. It increases flexibility, open time, adhesion to non-polar substrates and lowers melt viscosity. It is used in hot melt adhesives and sealants... view more
DYNACOLL® 7230 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. DYNACOLL® 7230 offers benefits such as increases open time, increases flexibility, lowers... view more
DYNACOLL® 7231 by Evonik is saturated polyester. It increases flexibility, open time, adhesion to non-polar substrates and lowers melt viscosity. It is used in hot melt adhesives and sealants... view more
DYNACOLL® 7250 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
DYNACOLL® 7255 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
Imicure® EMI-24 by Evonik acts as a curing agent and cure accelerator for high performance epoxy resin systems. It offers long pot life, excellent physical properties and high heat distortion... view more
TEGOPREN® 5847 by Evonik is a polyether siloxane. It is a non-ionic solvent-free, easy to handle liquid with 100% active content. It is suitable for adhesives used in the paper, wood and furniture... view more
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