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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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6 products match your search
Product Name
Supplier
Description
Bakelite Synthetics
GP® 5833 by Bakelite Synthetics is a solid novolac resin with low ionic impurities. Used as as curing agent for epoxy resins. Produces thermoset systems. GP® 5833 provides resistance to chemicals... view more
Bakelite Synthetics
GP® 834D54 by Bakelite Synthetics is a benzoxazine resin. Used as as curing agent for epoxy resins. Produces thermoset systems. GP® 834D54 provides resistance to chemicals and heat and a good... view more
Huntsman
Aliphatic polyamine adduct. It acts as a curing agent. Exhibits excellent mechanical properties, good salt spray and cathodic disbonding performance... view more
Puyang Tiancheng Chemical
THPA (Tetrahydrophthalic anhydride) by Puyang Tiancheng Chemical is a tetrahydrophthalic anhydride grade. It is soluble in benzene and acetone. It acts as an epoxy resin curing agent. THPA... view more
Shanghai Deborn
THPA by Shanghai Deborn is an epoxy resin-based curing agent. It is available in white-colored flake form. It is suitable for adhesives. THPA is partly soluble in petroleum ether and miscible in... view more
Yasuhara Chemical
YS Polyster TH130 by Yasuhara Chemical is a renewable, terpene phenolic resin. Acts as a tackifier. Provides outstanding tackiness, adhesive performance, improved heat resistance and cohesive properties. Enhances... view more
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