Accelerator DY 062 by Huntsman is a benzyl dimethyl amine based accelerator. It has an extremely low viscosity. Accelerator DY 062 is used for ambient as well as for high temperature cure epoxy... view more

Aradur® 1167 by Huntsman is a latent modified phenolic accelerator. Exhibits low dust powder and softening temperature. Suitable for heat curing epoxy systems. Provides good glass transition... view more

Aradur® 3123 by Huntsman is an imidazole based accelerator/latent curing agent. Exhibits very low solubility in epoxy resins and solvents at RT. Recommended as latent catalytic curing agent for... view more

Aradur® 9506 by Huntsman is a latent modified polyamine hardener. It exhibits high reactivity above 100°C, low solubility and outstanding latency at room temperature when blended with epoxy resins... view more

Aradur® 9664-1 by Huntsman is a curing agent used with Araldite® epoxy resins. It is 4,4' diaminodiphenylsulfone grade. Exhibits excellent thermal stability and high temperature properties with... view more

Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding... view more

GABEPRO™ GPS-331 by Huntsman is a curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high-temperature properties. It requires the elevated... view more

Irostic® M 7030 by Huntsman is ester-based TPUs for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Offers good resistance to washing agents... view more

Linear polyurethane elastomer. Used in hot-melt adhesives for shoe industry, automotive industry and textile industry. Possesses features including medium crystallization rate, long open time and... view more

Irostic® M 8304 LV / HV by Huntsman is a linear polyurethane elastomer. It is used in hot-melt adhesives for the shoe-, automotive- and textile industry. It possesses features including a strong crystallization... view more

Irostic® M 8304-HV by Huntsman is ester-based TPU for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Provides good resistance to washing agents... view more

Linear polyurethane elastomer. Used in hot-melt adhesives for shoe industry, automotive industry and textile industry. Possesses features including strong crystallization rate, short open time and... view more

Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites... view more

4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good... view more

Diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane. It is a micropulverized version of Matrimid® 5218. Soluble polyimide. Fully imidized polymer. Does not require high temperatures for... view more

Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more

Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more

Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting... view more

Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and... view more

Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the... view more