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Product Name
Supplier
Description
Accelerator DY 062
Huntsman
Accelerator DY 062 by Huntsman is a benzyl dimethyl amine based accelerator. It has an extremely low viscosity. Accelerator DY 062 is used for ambient as well as for high temperature cure epoxy...
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Applications
Adhesives
Polymers>Epoxies (EP)
Aradur® 1167
Huntsman
Aradur® 1167 by Huntsman is a latent modified phenolic accelerator. Exhibits low dust powder and softening temperature. Suitable for heat curing epoxy systems. Provides good glass transition...
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Applications
Adhesives
Electrical & Electronic Bonding>Cable Sealing
Electrical & Electronic Bonding>Poting & Encapsulating
Electrical & Electronic Bonding>Thermally & Electrically conductive
...
Aradur® 3123
Huntsman
Aradur® 3123 by Huntsman is an imidazole based accelerator/latent curing agent. Exhibits very low solubility in epoxy resins and solvents at RT. Recommended as latent catalytic curing agent for...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Rail
Electrical & Electronic Bonding>Poting & Encapsulating
...
Aradur® 9506
Huntsman
Aradur® 9506 by Huntsman is a latent modified polyamine hardener. It exhibits high reactivity above 100°C, low solubility and outstanding latency at room temperature when blended with epoxy resins...
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Applications
Adhesives
Automotive>Exterior vehicle (OEM)
Electrical & Electronic Bonding>Battery cover sealing & Battery assembly
Transportation (excl. Automotive)>Recreational vehicle
...
Aradur® 9664-1
Huntsman
Aradur® 9664-1 by Huntsman is a curing agent used with Araldite® epoxy resins. It is 4,4' diaminodiphenylsulfone grade. Exhibits excellent thermal stability and high temperature properties with...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Marine
Industrial Assembly>Sporting Goods
...
Aradur® 976-1
Huntsman
Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive>Interior vehicle (OEM)
...
GABEPRO™ GPS-331
Huntsman
GABEPRO™ GPS-331 by Huntsman is a curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high-temperature properties. It requires the elevated...
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Applications
Adhesives
Polymers>Epoxies (EP)
Irostic® M 7030
Huntsman
Irostic® M 7030 by Huntsman is ester-based TPUs for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Offers good resistance to washing agents...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Footwear & leather
Irostic® M 7711
Huntsman
Linear polyurethane elastomer. Used in hot-melt adhesives for shoe industry, automotive industry and textile industry. Possesses features including medium crystallization rate, long open time and...
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Applications
Adhesives>Hot-melt adhesives
Automotive
Industrial Assembly>Apparel / Textile (clothing)
Footwear & leather
Irostic® M 8304 LV / HV
Huntsman
Irostic® M 8304 LV / HV by Huntsman is a linear polyurethane elastomer. It is used in hot-melt adhesives for the shoe-, automotive- and textile industry. It possesses features including a strong crystallization...
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Applications
Adhesives>Hot-melt adhesives
Papers & Packagings
Footwear & leather
Automotive
Irostic® M 8304-HV
Huntsman
Irostic® M 8304-HV by Huntsman is ester-based TPU for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Provides good resistance to washing agents...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Footwear & leather
Irostic® M 8304-LV
Huntsman
Linear polyurethane elastomer. Used in hot-melt adhesives for shoe industry, automotive industry and textile industry. Possesses features including strong crystallization rate, short open time and...
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Applications
Adhesives>Hot-melt adhesives
Papers & Packagings
Automotive
Footwear & leather
Matrimid® 5218
Huntsman
Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites...
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Applications
Adhesives
Transportation (excl. Automotive)>Rail
Electrical & Electronic Bonding>Thermally & Electrically conductive
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Matrimid® 5292 A-2
Huntsman
4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good...
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Applications
Adhesives
Electrical & Electronic Bonding>Motor & Magnet bonding
Transportation (excl. Automotive)>Rail
Industrial Assembly>Sporting Goods
...
Matrimid® 9725
Huntsman
Diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane. It is a micropulverized version of Matrimid® 5218. Soluble polyimide. Fully imidized polymer. Does not require high temperatures for...
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Applications
Adhesives
Omicure® DDA 10
Huntsman
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 5
Huntsman
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 50
Huntsman
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-210
Huntsman
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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