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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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138 products match your search
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Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more
Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid... view more
Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro... view more
ANCAMINE® 2014AS by Evonik is a latent curing agent based on modified polyamine. It can also be used as accelerator for dicyandiamide (DICY). It offers extremely long pot life, to cure rapidly above... view more
IGM Resins
Esacure ONE by IGM Resins is a difunctional oligomeric alpha hydroxy ketone based type I free radical photoinitiator. It provides through and surface cure. It exhibits low VOC, low migration and low... view more
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