EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications... view more

EPICLON® TSR-601 by DIC Corporation is a 100% solid, elastomer modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 is used in adhesive... view more

EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 is used in elastomeric modified adhesives... view more

PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing... view more

PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance... view more