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Product Name
Supplier
Description
Irganox® 1010 EDS
BASF
Irganox® 1010 EDS by BASF is an odorless sterically hindered phenolic primary antioxidant. It is highly effective and non-discoloring. Possesses stabilizing properties. Provides benefits such as...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
Polymers>Polyesters
Polymers>Ethylene Co-terpolymers - Solids (EVA, EMA)
...
Dualite® M6001AE Discontinued
Chase Corporation
Expanded, flexible, ultra-low density thermoplastic hollow microsphere core filled with gas, and surface coated with calcium carbonate. Acts as a filler. Possesses non-friable and shear-stable...
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Applications
Adhesives
Sealants
Dualite® MS7000 Discontinued
Chase Corporation
Expanded, flexible, ultra-low density thermoplastic hollow microsphere core filled with gas, and surface coated with calcium carbonate. Acts as a filler. Possesses non-friable and shear-stable...
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Applications
Adhesives
Sealants
Elvamide® 8023R
DuPont
Nylon multipolymer resin. Possesses good adhesion to nylon yarns. Offers good abrasion resistance, high tensile strength and elongation. Provides advantages such as high melting point, economical in...
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Applications
Adhesives
Elvamide® 8063
DuPont
Elvamide® 8063 by DuPont is nylon multipolymer resin by DuPont for adhesives. Possesses good adhesion to nylon yarns. Offers good abrasion resistance, high tensile strength and elongation. Provides...
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Applications
Adhesives
KUREHA Microsphere H1100
Kureha
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H750
Kureha
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H850
Kureha
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
KUREHA Microsphere H950
Kureha
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere M330
Kureha
KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
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products matching your search
Elvacite® 4111
Lucite
Methyl methacrylate/ n-butyl methacrylate copolymer. It exhibits low VOC, low viscosity and low molecular weight. Possesses compatibility with alkyd-, cellulosic-, epoxy-, vinyl chloride- and rosin...
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Applications
Adhesives
Elvacite® 4144
Lucite
Poly (methyl methacrylate/ n-butyl methacrylate/ methacrylic acid). It has higher softening point. Exhibits good compatibility with many binders and plasticizers. Shows excellent solubility in a...
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Applications
Adhesives
S-30
Maruwa
S-30 by Maruwa is an electrically insulating aluminium nitride. Acts as a ceramic filler. Available in the form of spheres. Possesses high thermal conductivity which is 7 times higher than aluminum...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
S-50
Maruwa
S-50 by Maruwa is a spherical aluminium nitride designed for adhesive applications. Acts as a ceramic filler. Exhibits high thermal conductivity which is 7 times higher than aluminum oxide. S-50...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
S-80
Maruwa
S-80 by Maruwa is an aluminium nitride available in the form of sphere. Acts as a ceramic filler designed for adhesive applications. Exhibits a narrow distribution curve, good surface control, good...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® AG-SL150-16-TRD
Potters Industries
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
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