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Adhesives Ingredients
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Adhesives Ingredients
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Description
HRJ 10518
Heat-reactive octylphenol-formaldehyde resin. Provides a rapid cure at normal curing temperatures and adequate cure at lower temperatures. Used to formulate pressure sensitive adhesives...
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Applications
Adhesives>Hot-melt adhesives>Pressure sensitive (HMPSA)
SP 1044
Heat-reactive octylphenol and formaldehyde resin. Can be used to partially cross-link elastomeric materials to form a pressure sensitive mass...
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Applications
Adhesives>Hot-melt adhesives>Pressure sensitive (HMPSA)
SP 1056
Brominated octylphenol/formaldehyde heat reactive resin. Used in pressure sensitive adhesives. Provides improved cohesive strength and little color to the finished adhesive...
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Applications
Adhesives>Hot-melt adhesives>Pressure sensitive (HMPSA)
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