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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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Products Compatible with Technicure® MDU-11

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

ZOLDINE®

Adhesives ingredients supplied by Dow

3 products match your search
Product Name
Supplier
Description
HSP Distance: 0
ZOLDINE® MS-Plus by Dow is a low viscosity moisture scavenger based on 3-ethyl-2-methyl-2-(3-methylbutyl)-1,3-oxazolidine. It is fast-acting, safe and effective designed for sealants. It eliminates... view more
Applications
HSP Distance: 3.6
ZOLDINE® ZT-55 by Dow is a low viscosity 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane used as crosslinking and curing agent. Imparts great flexibility and elongation characteristics, and... view more
HSP Distance: 3.6
ZOLDINE® ZT-65 by Dow is a low viscosity, formaldehyde-free oxazolidine, 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a curing agent for phenolic/resorcinol adhesive resins and for... view more
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