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Adhesives Ingredients
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Product Name
Supplier
Description
Dynasylan® 1124
Evonik
Dynasylan® 1124 by Evonik acts as an adhesion promoter and surface modifier with excellent crosslinking properties. It is a secondary aminofunctional methoxy-silane possessing two symmetric silicon...
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Applications
Adhesives
Sealants
Polymers>Polyurethanes>PU-Prepolymers
Polymers>Silicones (Si)
...
8
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Dynasylan® 1189
Evonik
Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
10
Documents
Contact
Get Sample
ALBIFLEX® 296
Evonik
ALBIFLEX® 296 by Evonik is a flexible Bisphenol-A-epoxy-silicone block copolymer. It provides adhesion on many substrates, high mechanical strength and chemical resistance. It offers high elasticity...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2709
Evonik
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 801
Evonik
Ancamide® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 903MAV
Evonik
Ancamide® 903MAV by Evonik is an amidoamine curing agent. It is designed for use with liquid epoxy resin. It provides low viscosity, long pot life and pigment acceptance for high build intumescent...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® T
Evonik
Ancamide® T by Evonik acts an ambient or elevated temperature curing agent for liquid epoxy resin. It is designed to minimize the undesirable properties of diethylene triamine from which it is...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
POLYVEST® 110
Evonik
POLYVEST® 110 by Evonik is a non-functionalized, apolar, hydrophobic, stereospecific, unsaponifiable liquid polybutadiene grade. It has low viscosity and high concentration of 1, 4-cis double bonds...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
POLYVEST® EP MA 100
Evonik
POLYVEST® EP MA 100 by Evonik is a maleic anhydride adduct of a 1,4-cis polybutadiene with succinic anhydride groups randomly distributed along the polymer chains, which has a low molecular weight. It...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
POLYVEST® HT
Evonik
POLYVEST® HT by Evonik is an apolar, hydrophobic, stereospecific, hydroxyl-terminated liquid polybutadiene grade. It has low viscosity and high concentration of double bonds. It is an unsaturated...
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Applications
Adhesives
Sealants
Industrial Assembly>Insulating / Glass bonding
Electrical & Electronic Bonding
POLYVEST® MA 75
Evonik
POLYVEST® MA 75 by Evonik is a maleic anhydride functionalized liquid poybutadiene grade. It is an apolar hydrophobic hydrocarbon resin which is highly reactive binder and it is more polar and...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
Versalink® P 650
Evonik
Versalink® P 650 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as well...
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Applications
Adhesives
Sealants
Polymers>Polyurethanes
Buildings & constructions
...
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