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Adhesives Ingredients
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Ingredients Selector
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Product Name
Supplier
Description
AMICURE® CG-1200G
Evonik
Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its...
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Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-325
Evonik
AMICURE® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. AMICURE® CG-325 is used as a curing agent...
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Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-325G
Evonik
Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow...
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Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® CG-NA
Evonik
Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for...
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Applications
Adhesives
Polymers>Epoxies (EP)
AMICURE® TEDA
Evonik
Amicure® TEDA by Evonik is a high-purity catalyst. It is designed for polyurethane applications. Amicure® TEDA consists of minimum 99.95% of triethylenediamine on a water-free, amine-base. It is...
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Applications
Adhesives>Water-based adhesives
Polymers>Polyurethanes>PU-Prepolymers
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