Jun 5, 2023 | Product News
Henkel launches Loctite TLB 9300 APSi, an injectable adhesive that provides both structural bonding, as well as thermal conductivity in the battery system. The breakthrough product has already been...
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May 29, 2023 | Product News
Creative Materials launches 129-50LS, a high-temperature electrically conductive die-attach adhesive. This unique product is designed for application by syringe dispensing and may also be used with...
Huntsman announces the development of innovative polyurethane, carbon nanotube and epoxy materials at The Battery Show, which are all designed to help improve the integration of batteries into...
May 23, 2023 | Product News
Henkel Adhesive Technologies presented its range of sustainable and safe packaging solutions at METPACK 2023. The event was hosted from May 2 to 6 in Essen, Germany. Visitors got insights into...
May 22, 2023 | Product News
Chemique Adhesives launches Polyped 1, a new one-component pedestal adhesive specially formulated for bonding raised flooring pedestals to concrete subfloors. The adhesive requires no mixing, this...
Bostik extends its Born2Bond™ engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also...
May 16, 2023 | Product News
Sun Chemical will present its full sustainable portfolio of products for the flexible and label packaging markets across Latin America under the theme “Experience. Transformation.” during the Flexo...
May 15, 2023 | Product News
Master Bond launches Master Bond EP17HTDA-2, a one-component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally...
Panacol launches two dual-curing acrylic adhesive systems, Vitralit® UD 8055 and Vitralit® UD 8056. These adhesives principally cure with UV light. They also possess a secondary moisture post-cure...
May 9, 2023 | Product News
Henkel launches Loctite Ablestik 6395T, a die-attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages in integrated circuits (ICs). With 30...