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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Genamid® 235

Technical Datasheet | Supplied by BASF
Genamid® 235 by BASF is low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids formulations with low viscosity. Genamid® 235 gives rapid cure response.
Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Amidoamines
Chemical Composition
Physical Form
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