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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Genamid® 235

Technical Datasheet | Supplied by BASF
Low viscosity amidoamine resin. Used as curing agent for solid or liquid epoxy resins. Offers good compatibility with a wide range of epoxy products. Suits for high solids formulations with low viscosity. Gives rapid cure response.
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Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Amidoamines
Chemical Composition
Amidoamine
Physical Form
Various
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