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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Dicyanex® 200-X

Technical Datasheet | Supplied by Evonik
Dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. Can be used in electrical laminates, recreational and industrial pre-preg composites. Pulverized grade. Provides enhanced solubility in polar solvents (acetone, DMF), shelf stability of up to 6 months at 77 °F. Activation temperature can be easily varied from 356-203 °F with appropriate accelerator selection. No flow control additives to inhibit solubility. Typical cure schedule: 30 minutes to 2 hours at 356 °F; 45 minutes at 248 °F with 0.5 parts of curing agent. Recommended Use Level (phr, EEW=190): 4-15.
Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides
Chemical Composition
CAS Number
SpecialChem additionnal informations based on CAS Number : 461-58-5

Hansen Solubility Parameters

[19, 18.2, 11]
[δD - Dispersion force interactions, δP - Polar force interactions, δH - Hydrogen bond force interactions]

Please note, these HSP values are estimations. It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters; δD (Dispersion force interactions), δP (Polar forces interactions) and δH (Hydrogen bond force interactions). Hansen Solubility Parameters can help you find a wide range of products that are predicted to be compatible with Dicyanex® 200-X. A practical determination of these HSP values would provide higher certainty. Learn More.

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