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Adhesives Ingredients
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Adhesives Ingredients
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Description
BYK® -1790
BYK
BYK® -1790 by BYK is a silicon-free, polymer-based defoamer. It is recommended for solvent-free-, radiation-curing (UV "> It has no negative effect on the adhesive properties of the...
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Applications
Adhesives>Radiation Curing (UV/EB) adhesives
Adhesives>Reactive adhesives>Hot-Melt adhesives
Sealants
BYK® -3771
BYK
BYK®-3771 by BYK is solvent-free, polyether-modified, hydroxy-functional polydimethylsiloxane by BYK. It is a highly effective, surface additive that provides a strong reduction in surface tension...
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Applications
Adhesives>Radiation Curing (UV/EB) adhesives
Sealants
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