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Adhesives Ingredients
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Adhesives Ingredients
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TEGOPAC® Bond 170
Evonik
TEGOPAC® Bond 170 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants with PPG as the backbone polymer. Applications include liquid membranes (for roofing...
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Applications
Adhesives
Sealants
Buildings & constructions>Structural assembly
Buildings & constructions>Facades
...
TEGOPAC® Seal 100
Evonik
TEGOPAC® Seal 100 by Evonik is a moisture curing silane modified polymer with PPG as backbone. It is recommended for low modulus sealant formulations which are used in construction applications...
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Applications
Adhesives
Sealants
Buildings & constructions>Facades
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