The material selection platform
Adhesives Ingredients
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Adhesives Ingredients
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TEGOPAC® Bond 170
Evonik
TEGOPAC® Bond 170 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants with PPG as the backbone polymer. Applications include liquid membranes (for roofing...
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Applications
Adhesives
Sealants
Buildings & constructions>Structural assembly
Buildings & constructions>Facades
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