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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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128 products match your search
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Cardolite® Ultra LITE 513 by Cardolite is a low viscosity, mono-functional epoxy reactive diluent. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and... view more
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Cardolite® LITE 513E is an epoxy reactive diluent. It contains low total chlorine/halogen content (= 1000ppm) and exhibits low color & low viscosity. This glycidyl ether offers reduced shrinkage... view more
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® Ultra LITE 2009 is a very low viscosity and very light color phenalkamine epoxy curing agent (Gardener 1) that contains benzyl alcohol. It is specifically designed for improved color... view more
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1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to brownish liquid. It is used for impact and heat resistant adhesives, and accelerator... view more
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic... view more
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary... view more
Aquent Advance Material Technologies
Aqualac AYD-127 by Aquent Advance Material Technologies is bis-phenol A epoxy resin. It is a colorless or yellow viscous liquid with low toxicity. It can be modified to meet a wide variety of bonding needs. Generally, epoxy bonds... view more
Cray Valley (TotalEnergies)
Ricon® 184MA6 by Cray Valley (TotalEnergies) is a is a low molecular weight polybutadiene-styrene copolymer functionalized with maleic anhydride. It is recommended for use in sealants and pressure sensitive and... view more
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled product designed for liquid encapsulant applications in adhesives. Offers... view more
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low... view more
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other... view more
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition... view more
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and... view more
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