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Supplier
Description
Araldite® DY 91158
Huntsman
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Araldite® PY 4122
Huntsman
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include...
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Applications
Adhesives
Sealants
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Motor & Magnet bonding
...
EPALLOY® 7138
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Joint cement / Grouting
...
EPALLOY® 7170
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low...
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Applications
Adhesives
Sealants
Buildings & constructions>Concrete
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8220
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
...
EPALLOY® 8230
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Automotive
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8370 A85
Huntsman
EPALLOY® 8370 A85 by Huntsman is epoxy phenol novolac resin (85% solids in acetone). It combines low hydrolyzable chloride content with good reactivity. It is compatible with all standard curing agents...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® GE-30
Huntsman
ERISYS® GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly
...
GABEPRO™ GPE-221
Huntsman
GABEPRO™ GPE-221 by Huntsman is 3, 4– epoxycyclohexylmethyl-3' 4'– epoxycyclohexanecarboxylate. Acts as rheology modifier. It is a cycloaliphatic, diepoxy functional compound and the combination of...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly>Insulating / Glass bonding
RoyOxy® RA-9500
Huntsman
RoyOxy® RA-9500 by Huntsman is amidoamine-based curing agent. Has lower viscosity. RoyOxy® RA-9500 is used for solvent-free systems and encapsulating applications...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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