Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary... view more

Ricon® 184MA6 by Cray Valley (TotalEnergies) is a is a low molecular weight polybutadiene-styrene copolymer functionalized with maleic anhydride. It is recommended for use in sealants and pressure sensitive and... view more

Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form... view more

Ancamide® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films... view more

Versalink® P 250 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It can be blended with other liquid Versalink® curative products to... view more

Versalink® P 650 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as well... view more

EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with... view more

Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include... view more

Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include... view more

EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable... view more

EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low... view more

EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical... view more