The material selection platform
Adhesives Ingredients
OK
The material selection platform
Adhesives Ingredients
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Adhesives Ingredients
Ingredients Selector
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Products Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
29 464
)
Documents (
1 840
)
News (
2 725
)
REFINE YOUR SEARCH
(
active filters)
28
products match your search
Detailed
List
Product Name
Supplier
Description
Cardolite® NX-5607
Cardolite
Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
...
5
Documents
Contact
Get Sample
Cardolite® NX-5608
Cardolite
Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
...
5
Documents
Contact
Get Sample
AFC ACCELERATOR™ AMC-2
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Structural assembly
...
AFC ACCELERATOR™ ATC-3
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ricon® 184MA6
Cray Valley (TotalEnergies)
Ricon® 184MA6 by Cray Valley (TotalEnergies) is a is a low molecular weight polybutadiene-styrene copolymer functionalized with maleic anhydride. It is recommended for use in sealants and pressure sensitive and...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Bluesil™ ESA 7252 A & B
Elkem Silicones
Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form...
view more
Applications
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 801
Evonik
Ancamide® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Versalink® P 650
Evonik
Versalink® P 650 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as well...
view more
Applications
Adhesives
Sealants
Polymers>Polyurethanes
Buildings & constructions
...
EMS -622
Gelest (Mitsubishi Chemical)
EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Araldite® DY 91158
Huntsman
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Araldite® PY 4122
Huntsman
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include...
view more
Applications
Adhesives
Sealants
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Motor & Magnet bonding
...
EPALLOY® 7138
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Joint cement / Grouting
...
EPALLOY® 7170
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low...
view more
Applications
Adhesives
Sealants
Buildings & constructions>Concrete
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8220
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical...
view more
Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
...
View
all Huntsman
products matching your search
Epoxy CR-250
MACRO POLYMERS
Epoxy CR-250 by MACRO POLYMERS is an unmodified liquid epoxy resin based on bisphenol-A and epichlorohydrin. It is compatible with reactive and non-reactive diluents, plasticizers, and other...
view more
Applications
Adhesives
Sealants>Putty
Electrical & Electronic Bonding>Poting & Encapsulating
Silane USi-2302
Nanjing Union Silicon Chemical
?-Glycidoxypropyltriethoxysilane. It acts as an adhesion promoter. It is a colorless transparent liquid. As a component of adhesives and sealants, it improves both adhesion to the substrate and...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
1
2
Next >
Back to Top