The material selection platform
Adhesives Ingredients
OK
The material selection platform
Adhesives Ingredients
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Adhesives Ingredients
Ingredients Selector
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Products Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
511
)
Documents (
3
)
News (
24
)
REFINE YOUR SEARCH
(
active filters)
103
products match your search
Detailed
List
Product Name
Supplier
Description
Hardener XB 3473
Huntsman
Hardener XB 3473 by Huntsman is a latent polyamine based hardener. It allows parts manufacture to tailor specific formulation processing characteristics and cured polymer properties. Hardener XB...
view more
Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
Electrical & Electronic Bonding>Assembly
Industrial Assembly>Sporting Goods
...
Matrimid® 2292
Huntsman
Matrimid® 2292 by Huntsman is a diallyl ether of bisphenol-A based low viscosity resin. Used as a reactive diluent with epoxy, bismaleimide and polyimides. Exhibits excellent mechanical properties...
view more
Applications
Adhesives
Industrial Assembly>Sporting Goods
Medical>Medical device assembly
Electrical & Electronic Bonding>Assembly
...
Matrimid® 5218
Huntsman
Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites...
view more
Applications
Adhesives
Transportation (excl. Automotive)>Rail
Electrical & Electronic Bonding>Thermally & Electrically conductive
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Matrimid® 5292 A-2
Huntsman
4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good...
view more
Applications
Adhesives
Electrical & Electronic Bonding>Motor & Magnet bonding
Transportation (excl. Automotive)>Rail
Industrial Assembly>Sporting Goods
...
Matrimid® 5292B
Huntsman
Matrimid® 5292B by Huntsman is an O,O-Diallyl Bisphenol A based reactive diluent with epoxy, bismaleimide, polyimides. It exhibits outstanding heat performance and excellent mechanical properties at...
view more
Applications
Adhesives
Electrical & Electronic Bonding>Assembly
Electrical & Electronic Bonding>Poting & Encapsulating
Electrical & Electronic Bonding>Cable Sealing
...
Omicure® BC-120
Huntsman
Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or...
view more
Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 10
Huntsman
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
view more
Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 5
Huntsman
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 50
Huntsman
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-210
Huntsman
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-24M
Huntsman
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-35M
Huntsman
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-405M
Huntsman
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-410M
Huntsman
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-415M
Huntsman
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-52M
Huntsman
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Resin XB 4399-3
Huntsman
Resin XB 4399-3 is a tetra hydroxyphenyl ethane based solid polyfunctional epoxy resin. Exhibits high glass transition temperature, UV-blocking, better dimensional stability, higher cross-link...
view more
Applications
Adhesives
Industrial Assembly>Household appliance assembly
Automotive>Vehicle assembly (OEM)
Electrical & Electronic Bonding>Assembly
...
Resin XU 3508
Huntsman
Resin XU 3508 by Huntsman is a liquid toughened, bisphenol A based epoxy resin. Provides high toughness without decrease of glass transition temperature. It can replace partly or totally standard...
view more
Applications
Adhesives
Industrial Assembly>Household appliance assembly
Transportation (excl. Automotive)>Aircraft & Aerospace
Transportation (excl. Automotive)>Recreational vehicle
...
RoyOxy® RA-9500
Huntsman
RoyOxy® RA-9500 by Huntsman is amidoamine-based curing agent. Has lower viscosity. RoyOxy® RA-9500 is used for solvent-free systems and encapsulating applications...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
< Previous
1
2
3
4
5
6
Next >
Back to Top