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Product Name
Supplier
Description
EPALLOY® 8220
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
...
EPALLOY® 8230
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Automotive
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8250
Huntsman
EPALLOY® 8250 by Huntsman is a low viscosity epoxy phenol novolac resin. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. EPALLOY® 8250 is used...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
Buildings & constructions
EPALLOY® 8330
Huntsman
EPALLOY® 8330 by Huntsman is a epoxy phenol novolac resin exhibiting lower viscosity than competitively available commercial alternates. It is non-crystallizing and compatible with all standard curing...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8350
Huntsman
EPALLOY® 8350 by Huntsman is epoxy phenol novolac resin exhibiting slightly higher viscosity. It is non-crystallizing and compatible with all standard curing agents and most resin systems and...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8370
Huntsman
EPALLOY® 8370 by Huntsman is epoxy phenol novolac resin exhibiting slightly lower viscosity. It is compatible with all standard curing agents and most resin systems and solvents. It has low...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8370 A85
Huntsman
EPALLOY® 8370 A85 by Huntsman is epoxy phenol novolac resin (85% solids in acetone). It combines low hydrolyzable chloride content with good reactivity. It is compatible with all standard curing agents...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 9000
Huntsman
EPALLOY® 9000 by Huntsman is epoxy resin based on tris-hydroxy phenyl ethane, exhibiting very low melt viscosity. It helps to produce very hard cured compositions with high thermal and chemical...
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Applications
Adhesives
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® GE-24
Huntsman
ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy...
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Applications
Adhesives>Reactive adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Buildings & constructions>Joint cement / Grouting
Electrical & Electronic Bonding>Poting & Encapsulating
...
ERISYS® GE-29
Huntsman
ERISYS® GE-29 by Huntsman is a low viscosity, epoxidized brominated neopentyl glycol. It is used as a diluent and as a flame retardant for epoxy formulations in adhesives. It offers compatibility with...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® GE-30
Huntsman
ERISYS® GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly
...
ERISYS® RF-50
Huntsman
ERISYS® RF-50 by Huntsman is a formulated resorcinol/bisphenol F resin which combines low viscosity with a high degree of reactivity and outstanding chemical resistance. It is non crystallizing and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Flexibilizer® DY 965
Huntsman
Flexibilizer® DY 965 by Huntsman is a liquid phenol terminated polyurethane adduct. It acts as an adhesion promoter. Improves the adhesion on metals and has good impact resistance as well as...
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Applications
Adhesives
Transportation (excl. Automotive)>Marine
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Truck
...
Flexibilizer® XB 3333
Huntsman
Flexibilizer® XB 3333 by Huntsman is an adhesion promoter. It exhibits an increase in toughness and flexibility in hot curing (>100°C) thermoset formulations. It possesses good solubility in epoxy...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Assembly
Automotive>Vehicle assembly (OEM)
...
GABEPRO™ GPE-221
Huntsman
GABEPRO™ GPE-221 by Huntsman is 3, 4– epoxycyclohexylmethyl-3' 4'– epoxycyclohexanecarboxylate. Acts as rheology modifier. It is a cycloaliphatic, diepoxy functional compound and the combination of...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly>Insulating / Glass bonding
GABEPRO™ GPE-226
Huntsman
GABEPRO™ GPE-226 by Huntsman is a 3, 4 – epoxycyclohexylmethyl-3', 4' – epoxycyclohexanecarboxylate. Acts as cycloaliphatic epoxy resin. It reacts in the presence of acid anhydride curing agents at...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly>Insulating / Glass bonding
GABEPRO™ GPE-228
Huntsman
GABEPRO™ GPE-228 by Huntsman is a bis(3,4- epoxycyclohexylmethyl) adipate. Acts as flexibilizing cycloaliphatic epoxy resin. It reacts in the presence of acid anhydride curing agents at higher. With...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Industrial Assembly>Insulating / Glass bonding
HYPOX® DA323
Huntsman
HYPOX® DA323 by Huntsman is dimer acid adducted to an epoxidized Bisphenol-A resin. It is usually blended with other epoxy resins and diluents to improve thermal shock and impact resistance...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
HYPOX® RA 95
Huntsman
HYPOX® RA 95 by Huntsman is a high viscosity, bisphenol A epoxy resin modified butadeine-acrylonitrile elastomer. It exhibits higher temperature performance and greater green strength, making it...
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Applications
Adhesives
Automotive
Electrical & Electronic Bonding>Poting & Encapsulating
Hardener XB 3473
Huntsman
Hardener XB 3473 by Huntsman is a latent polyamine based hardener. It allows parts manufacture to tailor specific formulation processing characteristics and cured polymer properties. Hardener XB...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
Electrical & Electronic Bonding>Assembly
Industrial Assembly>Sporting Goods
...
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