EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled product designed for liquid encapsulant applications in adhesives. Offers... view more

EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines... view more

EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines... view more

EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle... view more

EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard... view more

EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200H by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Possesses ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®... view more

EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and... view more

EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications in adhesives. It combines exceptionally good bonding... view more

PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more

PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing... view more

PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and... view more

PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance... view more