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Product Name
Supplier
Description
Black Shield™ Sp. black dispersion 6C11B727
DyStar
Carbon black aqueous dispersion. It is easy to use, free flowing and viscosity stable pigment concentrate. Exhibits very good chemical resistance, heat resistance and exterior durability. Mostly...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Polymers>Acrylics & Acrylic Copolymers
Electrical & Electronic Bonding
...
Bluesil™ ESA 6024 A & B
Elkem Silicones
Bluesil™ ESA 6024 A & B by Elkem Silicones is a pourable, two component silicone rubber that cures at room temperature by a polyaddition reaction, to a very soft and translucent silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 6120 QC A & B
Elkem Silicones
Bluesil™ ESA 6120 QC A & B by Elkem Silicones is a pourable two components silicone rubber that cures quickly at room temperature by a polyaddition reaction, to a very soft and clear silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 7244 A & B
Elkem Silicones
Bluesil™ ESA 7244 A & B by Elkem Silicones is a liquid two-component, polyaddition heat curing silicone elastomer. It is a solvent-free, self-leveling grade designed for adhesive and sealant...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Industrial Assembly>Household appliance assembly
Automotive
...
Bluesil™ ESA 7250 A & B
Elkem Silicones
Bluesil™ ESA 7250 A & B by Elkem Silicones is a two component, optically clear, high strength silicone elastomer. Cures by a polyaddition reaction at room temperature. Curing can be accelerated by...
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Applications
Sealants
Electrical & Electronic Bonding
Bluesil™ ESA 7252 A & B
Elkem Silicones
Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form...
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Applications
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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SUPER SAP® CCR/CCF
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with fast hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
SUPER SAP® CCR/CCS
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
ALBIFLEX® 296
Evonik
ALBIFLEX® 296 by Evonik is a flexible Bisphenol-A-epoxy-silicone block copolymer. It provides adhesion on many substrates, high mechanical strength and chemical resistance. It offers high elasticity...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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