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Description
POLYVEST® HT
Evonik
POLYVEST® HT by Evonik is an apolar, hydrophobic, stereospecific, hydroxyl-terminated liquid polybutadiene grade. It has low viscosity and high concentration of double bonds. It is an unsaturated...
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Applications
Adhesives
Sealants
Industrial Assembly>Insulating / Glass bonding
Electrical & Electronic Bonding
POLYVEST® MA 75
Evonik
POLYVEST® MA 75 by Evonik is a maleic anhydride functionalized liquid poybutadiene grade. It is an apolar hydrophobic hydrocarbon resin which is highly reactive binder and it is more polar and...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
Versalink® P 650
Evonik
Versalink® P 650 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as well...
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Applications
Adhesives
Sealants
Polymers>Polyurethanes
Buildings & constructions
...
DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
EMS -622
Gelest (Mitsubishi Chemical)
EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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HE3131
Guangdong HaoHui New Materials
HE3131 by Guangdong HaoHui New Materials is a low viscosity aromatic acrylate oligomer. Exhibits weatherability, good adhesion, flexibility, abrasion resistance, low shrinkage & heat and water resistance. It is...
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Applications
Electrical & Electronic Bonding
HP6206
Guangdong HaoHui New Materials
HP6206 by Guangdong HaoHui New Materials is aliphatic urethane acrylate. It is a highly flexible oligomer offering good weatherability. It exhibits good adhesion & flexibility and non-yellowing properties. It is...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Accelerator 2950
Huntsman
Accelerator 2950 by Huntsman is a reactive tertiary amine based accelerator with low plasticizing effect. Used as co-hardener when used with polyurethane systems, polyamines, polyamidoamines and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Truck
Transportation (excl. Automotive)>Rail
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