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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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106 products match your search
Product Name
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Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more
IGM Resins
Esacure ONE by IGM Resins is a difunctional oligomeric alpha hydroxy ketone based type I free radical photoinitiator. It provides through and surface cure. It exhibits low VOC, low migration and low... view more
IGM Resins
Omnirad 1314 by IGM Resins is a high-performing photoinitiator particularly suitable for applications which require low yellowing and high photosensitivity. It is used in photosensitive formulations... view more
IGM Resins
Omnirad 4PBZ by IGM Resins is an effective Type II photoinitiator. Used to initiate radical polymerization of unsaturated oligomers after exposure to UV light. It exhibits faster cure and absorption at... view more
IGM Resins
Omnirad 784 by IGM Resins is a reactive photoinitiator. Used to initiate radical polymerization of unsaturated oligomers after exposure to visible light or UV light. Used as the sole initiator or in... view more
IGM Resins
Omnirad 819 by IGM Resins is a versatile photoinitiator for radical polymerization of unsaturated resins. It is suitable for clear-, white-, pigmented- and water-based systems. It provides through... view more
Suzorite® 15-Z by Imerys is a stable, inert specially delaminated pure phlogopite mica for use in adhesives. Possesses great thermal stability, high thermal conductivity, superior mechanical and... view more
Suzorite® 150-NY by Imerys is a stable, inert, platy, highly delaminated pure phlogopite mica designed for use in adhesives. Possesses great thermal stability, high thermal conductivity, superior... view more
Suzorite® 150-S by Imerys is a stable, inert, platy, highly delaminated pure phlogopite mica which is used in adhesives. Possesses great thermal stability, high thermal conductivity, superior... view more
Suzorite® 200-HK by Imerys is a stable, chemically inert, specially delaminated pure phlogopite mica. Possesses great thermal stability, high thermal conductivity, superior mechanical and electrical... view more
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