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Product Name
Supplier
Description
PARAPLEX® G-54
Hallstar
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides volume resistivity and dielectric strength as well as resistance to copper...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Polymers>Synthetic Rubbers
Polymers>Polychlorovinyls (PVC, PVDC)>Polyvinyl Chlorides (PVC)
...
PARAPLEX® G-57
Hallstar
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides a balance of the best properties of high and low molecular weight plasticizers...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Polymers>Polychlorovinyls (PVC, PVDC)>Polyvinyl Chlorides (PVC)
Electrical & Electronic Bonding
JLS- MC15
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Polyamides (PA)
Polymers>Synthetic Rubbers
...
JLS- MC25
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
JLS- MC50
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
Araldite® DY 91158
Huntsman
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Araldite® PY 4122
Huntsman
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include...
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Applications
Adhesives
Sealants
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Motor & Magnet bonding
...
EPALLOY® 7138
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Joint cement / Grouting
...
EPALLOY® 7170
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low...
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Applications
Adhesives
Sealants
Buildings & constructions>Concrete
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8220
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
...
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products matching your search
Suzorite® 200-HK
Imerys
Suzorite® 200-HK by Imerys is a stable, chemically inert, specially delaminated pure phlogopite mica. Possesses great thermal stability, high thermal conductivity, superior mechanical and electrical...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H1100
Kureha
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H750
Kureha
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H850
Kureha
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
KUREHA Microsphere H950
Kureha
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
view more
Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
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