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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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146 products match your search
Product Name
Supplier
Description
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides volume resistivity and dielectric strength as well as resistance to copper... view more
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides a balance of the best properties of high and low molecular weight plasticizers... view more
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with... view more
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with... view more
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with... view more
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include... view more
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include... view more
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable... view more
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low... view more
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical... view more
Suzorite® 200-HK by Imerys is a stable, chemically inert, specially delaminated pure phlogopite mica. Possesses great thermal stability, high thermal conductivity, superior mechanical and electrical... view more
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more
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