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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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729 products match your search
Product Name
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Description
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio... view more
1,7-Octadiene by Evonik acts as a cross-linker for polyolefins (PE and PP) and as well as for a number of other polymers. It complies with REACH. It is used in adhesives & sealants... view more
ALBIFLEX® 296 by Evonik is a flexible Bisphenol-A-epoxy-silicone block copolymer. It provides adhesion on many substrates, high mechanical strength and chemical resistance. It offers high elasticity... view more
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low... view more
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other... view more
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol... view more
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