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Product Name
Supplier
Description
SUPER SAP® CCR/CCS
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
1,7-Octadiene
Evonik
1,7-Octadiene by Evonik acts as a cross-linker for polyolefins (PE and PP) and as well as for a number of other polymers. It complies with REACH. It is used in adhesives & sealants...
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Applications
Adhesives
Sealants
Polymers>Polyolefins
Papers & Packagings
...
ALBIFLEX® 296
Evonik
ALBIFLEX® 296 by Evonik is a flexible Bisphenol-A-epoxy-silicone block copolymer. It provides adhesion on many substrates, high mechanical strength and chemical resistance. It offers high elasticity...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
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DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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