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Adhesives Ingredients
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Product Name
Supplier
Description
Talc LC-85
DANDONG RITIAN NANO TECHNOLOGY
Talc or magnesium silicate. It acts as a filler. It is crushed inorganic powder in white or gray color. It provides fire resistance, acid resistance, insulation resistance, and strong adsorbability...
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Applications
Adhesives
Electrical & Electronic Bonding
Talc LC-93
DANDONG RITIAN NANO TECHNOLOGY
Talc or magnesium silicate. It acts as a filler. It is crushed inorganic powder in white or gray color. It provides fire resistance, acid resistance, insulation resistance, and strong adsorbability...
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Applications
Adhesives
Electrical & Electronic Bonding
Talc MS-KYC
DANDONG RITIAN NANO TECHNOLOGY
Talc or magnesium silicate. It acts as a filler. It is crushed inorganic powder in white or gray color. It provides fire resistance, acid resistance, insulation resistance, and strong adsorbability...
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Applications
Adhesives
Electrical & Electronic Bonding
EPICLON® HP-4032D
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled product designed for liquid encapsulant applications in adhesives. Offers...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4700
DIC Corporation
EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-4770
DIC Corporation
EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-5000
DIC Corporation
EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPICLON® HP-6000
DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
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