BYK® -1790 by BYK is a silicon-free, polymer-based defoamer. It is recommended for solvent-free-, radiation-curing (UV "> It has no negative effect on the adhesive properties of the... view more

DYNACOLL® 7110 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more

DYNACOLL® 7130 by Evonik is a linear, saturated, amorphous copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding... view more

DYNACOLL® 7131 by Evonik is an amorphous, saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging... view more

DYNACOLL® 7140 by Evonik is an amorphous, saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging... view more

DYNACOLL® 7150 by Evonik is an amorphous, saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging... view more