Accelerator DY 062 by Huntsman is a benzyl dimethyl amine based accelerator. It has an extremely low viscosity. Accelerator DY 062 is used for ambient as well as for high temperature cure epoxy... view more

Aradur® 3123 by Huntsman is an imidazole based accelerator/latent curing agent. Exhibits very low solubility in epoxy resins and solvents at RT. Recommended as latent catalytic curing agent for... view more

Aradur® 9664-1 by Huntsman is a curing agent used with Araldite® epoxy resins. It is 4,4' diaminodiphenylsulfone grade. Exhibits excellent thermal stability and high temperature properties with... view more

Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding... view more

GABEPRO™ GPS-331 by Huntsman is a curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high-temperature properties. It requires the elevated... view more

Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more

Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more

Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting... view more

Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and... view more

Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the... view more

Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The... view more

Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more

Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more

Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more

Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more

Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more