LUCKAMIDE EA-330 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE EA-330 is used... view more

LUCKAMIDE F4 by DIC Corporation is a general purpose, mannich-type modified aliphatic polyamine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE F4 is... view more

LUCKAMIDE TD-960 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE TD-960 is... view more

LUCKAMIDE TD-961 by DIC Corporation is a solvent solution of polyamide adduct. Acts as a curing agent. Exhibits chemical resistance with drying characteristics. Shows compatibility with room... view more

LUCKAMIDE TD-977 by DIC Corporation is a solvent solution of polyamide amine adduct grade with drying characteristics. Acts as a curing agent. Shows compatibility with room temperature epoxy resin... view more

LUCKAMIDE TD-982 by DIC Corporation is a solvent-free, polyamide amine grade. Acts as a curing agent for room temperature epoxy resin. It is useable for long period of time. TD-982 is used as an... view more

LUCKAMIDE TD-984 by DIC Corporation is a solvent-less, polyamide amine grade. Acts as a curing agent. It is useable for long period of time. Shows compatibility with room temperature epoxy resin... view more

LUCKAMIDE TD-992 by DIC Corporation is a solvent solution of polyamine adduct with drying characteristics. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE TD-992 is diluted with... view more

LUCKAMIDE WH-614 by DIC Corporation is a mannich-type modified aliphatic polyamine grade with bonding properties. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE WH-614 is used as... view more

LUCKAMIDE WH-650 by DIC Corporation is a high strength, modified aliphatic polyamine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE WH-650 is... view more

LUCKAMIDE WN-405 by DIC Corporation is a mannich-type modified aliphatic polyamine grade. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-405 exhibits acid resistance... view more

LUCKAMIDE WN-620 by DIC Corporation is a modified aliphatic polyamine grade with high strength. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-620 is used as an... view more

Megaface® EFS-131 by DIC Corporation is PFAS-free, environment-friendly surfactant. It has a high surface tension reduction ability equal to or higher than that of fluorine-based products, and excellent uniform... view more

Megaface® EFS-321 by DIC Corporation is PFAS-free, environment-friendly, high-performance surfactant for adhesive applications. It has a high surface tension reduction ability equal to or higher than that of... view more

Megaface® EFS-521 by DIC Corporation is PFAS-free, environment-friendly surfactant suitable for adhesive applications. It is an ideal alternative to fluorosurfactant. It has a high surface tension reduction... view more

Megaface® EFS-801 by DIC Corporation is PFAS-free surfactant for adhesive applications. It provides very good surface smoothness. It has a high surface tension reduction ability equal to or higher than that of... view more

PHENOLITE LA-1356 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Provides high heat-, moisture- and chemical resistance. It can be diluted in methyl ethyl... view more

PHENOLITE LA-3018-50P by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Offers high heat-, moisture- and chemical resistance. It can be diluted in PGM solution... view more

PHENOLITE LA-7052 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. It can be diluted in methyl ethyl ketone. Offers high heat-, moisture- and chemical... view more

PHENOLITE LA-7054 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Possesses high heat-, moisture- and chemical resistance. Shows compatibility with epoxy... view more