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Product Name
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Description
PHENOLITE LA-7751
DIC Corporation
PHENOLITE LA-7751 by DIC Corporation is an ATN-type novolac phenol resin which exhibits high cross-linking density. Offers high heat-, moisture- and chemical resistance. Shows compatibility with...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE TD-2090
DIC Corporation
PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2091
DIC Corporation
PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2093
DIC Corporation
PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2106
DIC Corporation
PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2131
DIC Corporation
PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE VH-4150
DIC Corporation
PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE VH-4170
DIC Corporation
PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
UNIDIC V-8000
DIC Corporation
UNIDIC V-8000 by DIC Corporation is a solvent-soluble amide-imide resin which contain rigid imide structures and terminal carboxyl groups. Acts as a hardening agent for epoxy resins. Provides high...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
UNIDIC V-8002
DIC Corporation
UNIDIC V-8002 by DIC Corporation is a solvent-soluble amide-imide resin. Acts as a hardening agent. It contains rigid imide structures and terminal carboxyl groups. Designed for heat-resistant...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
UNIDIC V-8005
DIC Corporation
UNIDIC V-8005 by DIC Corporation is a solvent-soluble amide-imide resin, containing terminal carboxyl groups and rigid imide structures . Acts as a hardening agent. Provides high mechanical...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
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