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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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75 products match your search
Product Name
Supplier
Description
Ancamide® 507 by Evonik is a polyfunctional fatty amidoamine grade. It acts as a curing agent for liquid epoxy resins. It can be used alone or in the mixture with polyamides and other amidoamines... view more
Ancamide® 910 by Evonik is a curing agent. It is used in general-purpose, two-component adhesives. It possesses very good flexibility and peel strength, very good thermal shock resistance and good... view more
Ancamide® T by Evonik acts an ambient or elevated temperature curing agent for liquid epoxy resin. It is designed to minimize the undesirable properties of diethylene triamine from which it is... view more
Dicyanex® 1200 by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more
Dicyanex® 200-X by Evonik is a dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. It provides enhanced solubility in polar solvents. Dicyanex® 200-X is used in... view more
Dicyanex® 325 by Evonik is a pulverized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more
Epodil® 748 by Evonik is an aliphatic glycidyl ether of a mixture of C12-C14 aliphatic alcohols. It acts as a curing agent and a reactive diluent. It used to reduce the viscosity of epoxy resin... view more
Epodil® 750 by Evonik is diglycidyl ether of 1,4-butanediol. It acts as a curing agent. It provides maximum viscosity reduction with physical and performance properties. Epodil® 750 is used in... view more
Imicure® AMI-1 by Evonik acts as a dicyandiamide accelerator and curing agent. It is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid... view more
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
Imicure® EMI-24 by Evonik acts as a curing agent and cure accelerator for high performance epoxy resin systems. It offers long pot life, excellent physical properties and high heat distortion... view more
Imicure® Imidazole by Evonik acts is an elevated-temperature curing agent for epoxy resins. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is readily compatible... view more
VESTAMIN® IPD by Evonik is a cycloaliphatic diamine based on isophorone. It is used in adhesives. It is the main component for curing agent formulations, cold and heat curing of epoxy resin systems... view more
VESTAMIN® TMD by Evonik is an aliphatic, trimethyl hexamethylene diamine grade. It is used as a cold and heat curing agent for epoxy resin systems. VESTAMIN® TMD is used in adhesive applications. It... view more
VESTAMIN® V214 by Evonik is a modified aliphatic diamine grade. It acts as a curing agent. VESTAMIN® V214 is designed for cold-curing of epoxy resin systems... view more
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