Amicure® CG-NA by Evonik is an unpulverized grade of dicyandiamide. It is designed for use as a latent curing agent for epoxy resins in solvent-based processes. Amicure® CG-NA is suitable for... view more

AMICURE® DBU-E by Evonik acts as a cure accelerator. It is a low ionic impurity grade of diazabicycloundecene which is an accelerator for phenolic novolac and other epoxy cures. It offers advantages... view more

AMICURE® PACM by Evonik is an unmodified cycloaliphatic amine-based curing agent. On heat-curing, it offers good resistance against acids, alkalis, water and hydrocarbon solvents. It possesses low... view more

Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more

Amicure® UR-41 by Evonik acts as an accelerator for dicyandiamide cured epoxy resins. It provides longer pot life than standard substituted urea accelerators without increasing activation... view more

Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more

Amicure® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more

Amicure® UR2T by Evonik is a substituted urea-based cure accelerator. It is used in one-pack paste and film adhesives. It possesses good flow properties. Amicure® UR2T offers benefits such as rapid... view more

Amicure® UR7/10 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. It is supplied as a micro... view more

Ancamine® 1482 by Evonik is a liquid eutectic combination of aromatic polyamines. It acts as a curing agent. It is designed for use in the elevated temperature cure of liquid epoxy resin. It offers... view more

Ancamine® 1483 by Evonik is an aliphatic amine adduct. It is suitable for adhesive applications. It acts as a curing agent. Ancamine® 1483 offers advantages such as rigidity, high physical strength... view more

Ancamine® 1608 by Evonik is a light-colored aliphatic amine adduct curing agent designed for epoxy resins. It possesses good solvent-, hot water- and alcohol resistance. It offers fast cure speed... view more

ANCAMINE® 1618 by Evonik is a modified cycloaliphatic amine-based curing agent. It is designed for ambient or low temperature liquid epoxy resins. It offers very low color and good color stability.It... view more

Ancamine® 1637-LV by Evonik is a low viscosity version of Ancamine® 1637. It is a Mannich base curing agent with a fast thin film set time, even under low temperature, humid conditions. It possesses... view more

ANCAMINE® 1638 by Evonik acts as a curing agent. It is a modified aliphatic amine designed for use with liquid epoxy resin cured at ambient or elevated temperature. It exhibits good resistance to... view more

Ancamine® 1767 by Evonik acts as an epoxy curing agent. It can be used in combination with polyamides or amidoamines to flexibilize systems. It is also used to accelerate other curing agents. It is... view more

Ancamine® 1768 by Evonik is a modified aliphatic amine based curing agent with low viscosity. It is used in fast-setting adhesives. It offers fast cure at ambient and low temperatures. Ancamine®... view more

ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low... view more

Ancamine® 1784 by Evonik is a room temperature, low viscosity modified aliphatic amine hardener for epoxy resins. It acts as a curing agent. It exhibits excellent color, moisture insensitivity, long... view more

ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other... view more