Epoxy system made of a modified, clear liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as... view more

Epoxy system made of modified liquid epoxy resin mixed with fast hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood... view more

Epoxy system made of modified liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood... view more

APR Polyamine by Epoxy Chemicals is an amine curing agent for epoxy resins. It is a very low viscosity, fast settling grade. It imparts high strength. APR Polyamine is suitable to be used as... view more

FS-290 Polyamine is a modified polyamine grade by Epoxy Chemicals. It acts as a curing agent for epoxy resins. It is an economic, low viscosity grade and offers fast settling time. It imparts high... view more

HY 40 by Ergon is hydrotreated naphthenic-based mineral oil. It has very low aromatic content and excellent solvency. It shows excellent color with resistance to discoloration by heat or ultraviolet... view more

HY P40 by Ergon is hydrotreated mineral oil. It shows excellent color with resistance to discoloration by heat or ultraviolet light. It has very low aromatic content and excellent solvency. HY P40... view more

HY P43 by Ergon is severely hydrotreated mineral oil. It has very low aromatic content, excellent solvency and very good color with resistance to discoloration by heat or ultraviolet light. HY P43... view more

HyPrene 100 by Ergon is a hydrotreated naphthenic process oil. Provides low pour point, low odor, excellent color and good solvency. Suitable for use in adhesives and sealants. It is insoluble in... view more

HyPrene 100E by Ergon is a hydrotreated naphthenic process oil with good solvency. Exhibits low pour point, low odor and excellent color. Used for adhesives and sealants. Shows resistance to... view more

70:30 Blend of oligo [2-hydroxy-2-methyl-1-[4-(1-methylvinyl) phenyl] propanone] and 2-hydroxy-2-methyl-1-phenyl-1-propanone. Acts as a fast curing type-I photo initiator. It is soluble in most... view more

Oligo [2-hydroxy-2-methyl-1-[4-(1-methylvinyl) phenyl] propanone] and 2-hydroxy-2-methyl-1-phenyl-1-propanone. Acts as a very fast curing type-I photo initiator. It is soluble in most monomers... view more

50:50 Liquid blend of 2-hydroxy-2-methyl-1-phenyl-1-propanone and diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide. Acts as a photo initiator. It is soluble in most monomers, oligomers and... view more

It acts as a photoinititiator. It is soluble in most monomers, oligomers and pre-polymers but insoluble in water. PL -460 is an easy to use liquid. Offers very fast curing and low yellowing... view more

Eutectic blend made up of a 1:1 mixture of 1-hydroxy-cyclohexylphenyl-ketone (PL-CPK) and benzophenone (PL-BPO). Acts as a photoinitiator. It is an easy to use liquid. PL -500 is soluble in most... view more

Mixture of Bis(1,2,2,6,6-pentamethyl-2,6,6-pentamethyl-4-piperidyl)sebacate. Acts as a highly efficient liquid hindered amine light stabilizer... view more

TC-K 518 by Evergreen Chemicals is an epoxy resin manufactured from bisphenol-A and epichlorohydrin. It can be cured by curing agents at ambient conditions such as aliphatic polyamines, polyamides... view more

TEGOPAC® RD 1 by Evonik is a silane-modified polymer used to decrease viscosity of adhesives & sealant formulations. It acts as a cross-linker which releases ethanol during the curing process. It... view more

TEGOPAC® Bond 170 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants with PPG as the backbone polymer. Applications include liquid membranes (for roofing... view more

TEGOPAC® Bond 150 by Evonik is a plasticizer-free & solvent-free silane-terminated polymer with PPG backbone. It exhibits combination of outstanding through-cure & in-depth cure, excellent elastic... view more

TEGOPAC® Bond 160 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants where low formulation viscosity or very high filler load is required. Applications include... view more

TEGOPAC® Bond 251 by Evonik is a silane modified hybrid polymer with a modified backbone that contains hydrophilic segments and lateral crosslinking groups. It is a plasticizer and solvent-free... view more