L-MODU™

Adhesives ingredients supplied by Idemitsu Kosan

L-MODU™ is low molecular weight and low modulus polypropylene. This homo polypropylene polymer exhibits good flexibility, high adhesive strength, slow crystallization and high heat stability against any degradation. It ensures good sprayability, long open time, transparency and low VOC in your applications. L-MODU™ is expected to be used as adhesive base polymer for broad range of applications including hot melt adhesives.

4 products match your search

Detailed List

Product Name

Supplier

Description

L-MODU™ S400 Discontinued

Idemitsu Kosan

L-MODU™ S400 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky... view more

Applications

L-MODU™ S410 Discontinued

Idemitsu Kosan

L-MODU™ S410 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky... view more

Applications

L-MODU™ S600 Discontinued

Idemitsu Kosan

L-MODU™ S600 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky... view more

Applications

L-MODU™ S901 Discontinued

Idemitsu Kosan

L-MODU™ S901 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky... view more

Applications